Electrical arrangement including an insulating underfill region with a high fill factor

US12057784B2 · kind B2 · utility

Assignee

• ROLLS-ROYCE DEUTSCHLAND LTD & CO KG · DE

Inventors

• Stanley Buchert · Herzogenaurach, DE
• Uwe Waltrich · Forchheim, DE

Key dates

• Filing date: Jun 21, 2023
• Grant date: Aug 6, 2024
• Expiry date: Jun 21, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/36
• WIPO field: Electrical machinery, apparatus, energy
• WIPO sector: Electrical engineering

Abstract

A power electronics converter includes a substrate and a converter commutation cell including a power circuit. The power circuit includes at least one power semiconductor switching element and at least one capacitor. Each power semiconductor switching element is comprised in a power semiconductor prepackage. An electrical connection side of the respective power semiconductor prepackage is spaced apart in a z direction from the substrate so as to define a prepackage gap between the substrate and the electrical connection side. At least a portion of the prepackage gap is filled with an electrically insulating material having voids. A converter parameter σ defined as an insulation fill factor divided by a maximum void size is greater than or equal to 10/mm. The insulation fill factor is defined as a cumulated volume of the voids subtracted from a volume of the electrically insulating material divided by the volume of the electrically insulating material.