Thermal imaging with scanning at sub-pixel levels
US12058453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Dec 21, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N5/33
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal imaging device having a scan mechanism operable to effectuate sequentially predetermined offsets, each configured between a thermal image of thermal radiations in a defined area on an imaging plane and an array of micro mirrors configured on a substrate. A respective image of a light pattern of a light beam reflected by a light reflection portion of each respective micro mirror in the array can be captured, when a rotation of the respective micro mirror, caused by radiation incident on a radiation absorption surface of the respective micro mirror, is stabilized at a respective offset. After computing a respective measurement of intensity measured by the respective micro mirror based on the respective image captured for the respective offset, a processor computes measurements of intensity of radiation in sub-areas of the thermal image, from measurements of intensity for the predetermined offsets, to generate a high resolution output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.