Cooling assembly and liquid cooling apparatus
US12058839B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2022 |
| Grant date | Aug 6, 2024 |
| Priority date | — |
| Expiry date | Jan 26, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a liquid cooling assembly and a liquid cooling apparatus. The liquid cooling assembly includes: two heat conducting plates, configured to perform heat dissipation on a storage module attached to each of the heat conducting plates; a liquid cooling tube, disposed on an end of the each heat conducting plates and configured to perform liquid cooling on the heat conducting plates; and an elastic support, disposed between the two heat conducting plates and configured to apply elastic pressure to the heat conducting plates during attachment between the heat conducting plates and the storage modules, to cause the heat conducting plates to be tightly attached to surfaces of the storage modules, and cause the storage modules to be easily separated from the heat conducting plates after the elastic support is removed from the two heat conducting plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.