Method and apparatus to process and bond layers in an additive manufacturing system
US12059838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2023 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Jan 13, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An improved method and apparatus for adding a new layer to a stack of previously processed layers. In an example, a method is provided for mounting the previously processed layer on a build platform, mounting the new layer on a substrate, aligning the new layer with the previously processed layer, moving the new layer and the previously processed into contact with one another, and applying energy to the new layer from an energy source through the substrate to simultaneously process the new layer and bond the new layer to the previously processed layer to form a bonded processed multilayer stack on the build platform. A flexible compliant pressure conveyance media is moved into contact with the substrate to apply pressure to the new layer while the energy is being applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.