MEMS chip assembly having multiple trenches
US12059898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2020 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Jan 17, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/052
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A MEMS chip assembly includes: a support structure having a chip mounting surface; a MEMS chip mounted on the chip mounting surface, the MEMS chip having an active surface including one or more rows of MEMS devices and a row of bond pads disposed alongside a connection edge of the MEMS chip and parallel with the rows of MEMS devices; electrical connectors connected to the bond pads; and an encapsulant material covering the electrical connectors. The MEMS chip has a plurality of trenches defined in the active surface, the trenches extending parallel with the rows of MEMS devices and disposed between the bond pads and the MEMS devices. The encapsulant material does not encroach past the trenches towards the MEMS devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.