System and method for hole inspection
US12061169B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2022 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Nov 24, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R33/091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method are provided for inspecting challenging material locations such as holes. The system may include a sensor cartridge (“mandrel”) for hole inspection that has a helical portion to which a sensor array is attached. The radius of the helical portion can be increased or decreased by applying a torque to the helical portion thereby allowing the sensor to be inserted into a hole or pressed against the wall of the hole. A scanner is described to which mandrels can be quickly connected and changed enabling an inspector to quickly switch between different mandrels (e.g., for different holes sizes and sensor configurations). Also disclosed is an inspection procedure and data processing algorithm for performing an inspection. The data processing algorithm utilizes a signature library for enhancing the detection or sizing of features of interest such as cracks. The algorithm and library can account for material edges, various material types.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.