Light-emitting module comprising plurality of light emitting diodes and epitaxial region and manufacturing method thereof and display device
US12062649B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Nov 19, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B45/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting module includes a light-emitting panel which includes a first rigid substrate, a flexible substrate, a circuit layer, a light-emitting element, and a driver chip. The flexible substrate includes a light-emitting region, a bending region, and an epitaxial region, and the light-emitting region and the epitaxial region are located on two ends of the bending region. The circuit layer includes a first connection terminal located on the epitaxial region and the driver chip is bonded to the first connection terminal. The light-emitting element is located on the light-emitting region, and the light-emitting element emits light toward the first rigid substrate. The flexible substrate is bent in the bending region and the flexible substrate in the epitaxial region is bent to a side of the light-emitting elements facing away from the first rigid substrate. The process difficulty can be reduced and the product yield can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.