Sensors having an active surface
US12062674B2 · kind B2 · utility
0Cited by
5References
20Claims
0Family size
Assignee
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Key dates
| Filing date | May 25, 2022 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | May 25, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00011
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed in one example is an apparatus including a substrate, a sensor over the substrate including an active surface and a sensor bond pad, a molding layer over the substrate and covering sides of the sensor, the molding layer having a molding height relative to a top surface of the substrate that is greater than a height of the active surface of the sensor relative to the top surface of the substrate, and a lidding layer over the molding layer and over the active surface. The lidding layer and the molding layer form a space over the active surface of the sensor that defines a flow channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.