Heat dissipation film, display module, and electronic device
US12063843B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Oct 12, 2021 |
| Grant date | Aug 13, 2024 |
| Priority date | — |
| Expiry date | Oct 12, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a heat dissipation film, including: an elastic cushion layer, provided with a first fingerprint through-hole; a heat dissipation layer, disposed on a first side surface of the elastic cushion layer, wherein the heat dissipation layer is provided with a second fingerprint through-hole, an orthographic projection of the first fingerprint through-hole on the first side surface being within an orthographic projection of the second fingerprint through-hole on the first side surface; and an isolation layer, disposed on the first side surface of the elastic cushion layer, wherein the isolation layer is provided with a third fingerprint through-hole, the orthographic projection of the first fingerprint through-hole on the first side surface being at least overlapped with an orthographic projection of the third fingerprint through-hole on the first side surface, and a surface, distal from the first side surface, of the isolation layer is non-adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.