Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs
US12064090B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Oct 18, 2041 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B1/0676
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.