Element substrate and print head
US12064965B2 · kind B2 · utility
0Cited by
1References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Feb 16, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/14129
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
According to the present invention, it is possible to provide an element substrate and a print head with which a decrease in yield and an increase in cost in a manufacturing process can be suppressed. For that purpose, a VH wiring line and a GNDH wiring line are provided in parallel in the same layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.