Testing apparatus and method of using the same
US12066457B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2023 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | May 11, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2896
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.