Method of fabricating an electronic device comprising an optical chip
US12066678B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 16, 2023 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Feb 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/50
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An electronic device includes a carrier substrate having a front face. An electronic chip is mounted on the front face of the carrier substrate and includes an optical component. An encapsulation cover is mounted on top of the front face of the carrier substrate and bounds a chamber within which the chip is situated. A front opening extends through the cover and is situated in front of the optical component. An optical element, designed to allow light to pass, is mounted within the chamber at a position which covers the front opening of the encapsulation cover. The optical element includes a central region designed to deviate the light and having an optical axis aligned with the front opening and the optical component. A positioning pattern is provided on the optical element to assist with mounting the optical element to the cover and mounting the cover to the carrier substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.