Communication interface structure and Die-to-Die package
US12066968B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 13, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Dec 15, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2213/40
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A communication interface structure and a Die-to-Die package are provided. The communication interface structure includes first bumps arranged in a first row-column configuration, second bumps arranged in a second row-column configuration, and conductive lines disposed between the first bumps and the second bumps to connect each of the first bumps to each of the second bumps. The first bumps in neighboring rows are alternately shifted with each other. The second bumps are disposed under or over the first bumps, wherein each of the second bumps in even rows is at a position shifted in a column direction from a center of each of the first bumps in the even rows, and each of the second bumps in odd rows is at a position between two of the second bumps in the even rows in the column direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.