Manufacturing method for glass substrate and glass substrate
US12068181B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2023 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Oct 3, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/15
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To suppress lowering of dimensional accuracy. A manufacturing method for a glass substrate is a manufacturing method for the glass substrate that supports a semiconductor device, the manufacturing method including: generating a glass base plate; measuring a thickness, a thickness deviation, and a warpage amount of the glass base plate; screening the glass base plate based on the thickness of the glass base plate; generating a plurality of glass blanks by cutting the screened glass base plate; setting a first polishing condition for the glass blank based on the thickness, the thickness deviation, and the warpage amount of the glass base plate; generating a glass plate by polishing a surface of the glass blank based on the first polishing condition; measuring a thickness, a thickness deviation, and a warpage amount of the glass plate; screening the glass plate based on the thickness of the glass plate; setting a second polishing condition for the glass plate based on the thickness, the thickness deviation, and the warpage amount of the glass plate; and polishing a surface of the screened glass plate based on the second polishing condition to generate a rectangular glass substrate in …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.