Patent · US Active

Power module

US12068209B2 · kind B2 · utility

0Cited by

2References

10Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Stephan Jonas · Gerlingen, DE
Norbert Reichenbach · Amberg, DE
Juergen Trottmann · Falkenberg, DE

Key dates

Filing date	Mar 30, 2022
Grant date	Aug 20, 2024
Priority date	—
Expiry date	Jan 3, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH02M7/003
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.