Package substrate and method of manufacturing the same
US12068210B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Jul 15, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Oct 1, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09154
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package substrate that prevents breakage of a core substrate is provided. A package substrate includes a core substrate made of a brittle material, at least one insulating layer formed on one surface or both surfaces of the core substrate, and one or more wiring layers formed on the insulating layer and/or in the insulating layer, the core substrate being exposed from an outer peripheral portion of the insulating layer, and the insulating layer being chamfered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.