Method for producing a component, and component
US12068304B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Aug 22, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an embodiment a component includes a semiconductor chip, a connection member and a carrier, wherein the semiconductor chip is mechanically and electrically connected to the carrier via the connection member, wherein the connection member includes a contiguous metallic connecting layer and a plurality of metallic through-vias extending vertically through the connecting layer and being laterally spaced from the connecting layer by insulating regions, wherein the insulating regions are filled with a gaseous medium and are hermetically sealed, and wherein the gaseous medium contains an insulating gas having a higher breakdown field strength compared to nitrogen, or wherein a gas pressure is less than 1 mbar in the hermetically sealed insulating regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.