Packages for high-power laser devices
US12068574B2 · kind B2 · utility
0Cited by
8References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Oct 24, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4087
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In various embodiments, a laser emitter such as a diode bar is cooled during operation via jets of cooling fluid formed by ports in a cooler on which the laser emitter is positioned. The jets strike an impingement surface of the cooler that is thermally coupled to the laser emitter but prevents direct contact between the cooling fluid and the laser emitter itself.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.