Method of manufacturing housing for electronic communication device
US12069193B2 · kind B2 · utility
0Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Oct 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M1/185
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Provided is an electronic device that includes a housing at least partially including a metal portion, a glass plate mounted on one surface of the housing, and a buffer disposed at least on the metal portion on one face of the housing and disposed adjacent to an edge of the glass plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.