Camera module having circuit board with imrpoved flatness and electronic device
US12069361B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2023 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | May 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photosensitive assembly includes a circuit board. The circuit board has a first surface, a second surface opposite to the first surface, and a first through hole extending through the first surface and the second surface. A photosensitive chip is disposed on the second surface. The photosensitive chip has a photosensitive area and a non-photosensitive area connected to the photosensitive area, the non-photosensitive area is electrically connected to one side of the second surface, and the photosensitive area is exposed from the first through hole. A reinforcing plate is disposed on the first surface. A thermal conductive layer is disposed on the photosensitive chip, and the thermal conductive layer includes a silica gel or a metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.