Dynamic control of heat sink pressure
US12069794B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jul 6, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Feb 15, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10734
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Techniques are provided herein for dynamic pressure control of a heat sink. In one example embodiment, an apparatus includes a Ball Grid Array (BGA) device, a heat sink thermally coupled to the BGA device, and a pressure control assembly configured to dynamically control a pressure of the heat sink on the BGA device based on a temperature associated with the BGA device. The pressure control assembly includes a Shape Memory Alloy (SMA) washer configured to apply a first amount of the pressure when the SMA washer is in a first state, and a second amount of the pressure when the SMA washer is in a second state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.