Patent · US Active

Broadside coupled radio frequency interconnect

US12069798B1 · kind B1 · utility

1Cited by

1References

20Claims

0Family size

Assignee

Lockheed Martin Corporation · US

Inventors

Thomas Henry Hand · Littleton, US
Joshua David Gustafson · Castle Rock, US
Joseph M. Torres · Littleton, US
Aaron Christopher Rothlisberger · Littleton, US
Roger Douglas Hasse · Superior, US
Adam Blair Hess · Denver, US
Madison P. Gast · Aurora, US
Braiden T. Olds · Highlands Ranch, US
Colton Brent Martin · Austin, US

Key dates

Filing date	Apr 22, 2022
Grant date	Aug 20, 2024
Priority date	—
Expiry date	Nov 19, 2042

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09227
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Enhanced components and assemblies for connector-less radio frequency (RF) interconnect systems are provided. One example includes two circuit boards each with a broadside coupling feature comprising a tapered circuit board trace having a terminal portion. The circuit boards are positioned in close proximity to establish a desired gap, and a dielectric material is positioned within the gap between circuit boards. The broadside coupling features of the circuit boards are then configured to convey RF signals over the gap without electrical contact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.