Bonding apparatus
US12069811B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Apr 20, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.