Housing for multifunctional electronic device and method for preparing the same
US12069812B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2021 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Dec 29, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a housing for a multifunctional electronic device and a method for preparing the same. The housing comprises an upper cover and a lower cover fixed together to form an internal space, wherein the upper cover comprises a first layer formed of a first thermoplastic material, said first layer having a thickness in the range of 0.8 mm to 1.5 mm and comprising at least two functional components integrated thereon; the lower cover comprises a second layer formed of a second thermoplastic material, said second layer having a thickness in the range of 2 mm to 4 mm; and the housing for the multifunctional electronic device comprises at least 90 wt % of the thermoplastic materials, relative to the total weight of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.