Conformal electromagnetic interference shielding film
US12069845B2 · kind B2 · utility
0Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2022 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Nov 6, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.