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US12069883B2 · kind B2 · utility
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0References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 17, 2019 |
| Grant date | Aug 20, 2024 |
| Priority date | — |
| Expiry date | Sep 9, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/311
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A first resin layer is provided to fill a slit formed in at least one inorganic insulating film included in a TFT layer, and extending in a longitudinal direction of a fold portion. A plurality of first routed wires are provided above the first resin layer, and extending in parallel with one another and intersecting with the longitudinal direction of the fold portion. A first protective layer is formed between, and in contact with, the first resin layer and the first routed wires, and provided to at least partially coincide with each of the first routed wires.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.