Stimulation system with monolithic-lead component connected to skull mount package
US12070611B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2019 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Aug 7, 2040 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61N1/36082
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A stimulation system can include one or more stimulating components, each of which can include one or more electrodes and one or more leads. Each lead can be connected at a first end of the lead to an electrode of the one or more electrodes and can be connected at a second end of the lead to a bonding pad of the one or more bonding pads. The stimulation system can also include a cylindrical substrate. Each stimulating component can be secured to a surface of the cylindrical substrate. The stimulation system can further include a skull-mount package that includes electronics that identify stimulation parameters. The bonding pads can be electrically connected to the electronics. The skull-mount package can further include one or more bonding pads. Each lead can be directly electrically and physically connected to a bonding pad of the one or more bonding pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.