Direct metal deposition of electronic device components
US12070797B1 · kind B1 · utility
0Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Mar 17, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A 3D printed metallic structure can include an elongated body defining an orifice, the elongated body divisible into a plurality of sectioned elements. The plurality of sectioned elements configured for use a housing or enclosures of electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.