Method of using polishing pad
US12070833B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 26, 2023 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Jun 26, 2043 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.