Microstructure and method of producing a microstructure
US12071341B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2020 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | May 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2207/021
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A microstructure for use in a micro electro-mechanical device comprises a substrate having a top surface and a rear surface and a thin-film structure arranged at the top surface of the substrate. The thin-film structure comprises a raised portion spaced from the substrate, a lower portion of the thin-film structure, which is in mechanical contact with the substrate, at least one protruding portion, the protruding portion being hollow and having at least one sidewall and a bottom part and the protruding portion mechanically connecting the raised portion to the substrate via the bottom part, and at least one further sidewall of the thin-film structure at a distance to the at least one protruding portion, wherein the further sidewall mechanically connects the lower portion with the raised portion of the thin-film structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.