Multilayer tape constructions for low-temperature vibration damping with tunable adhesion
US12071570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Feb 27, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Provided herein are multilayer tape constructions comprising a damping layer and a bonding layer, wherein the multilayer tape construction effectively dissipates vibrations at low temperatures. The materials and configurations of the layers are selected such that the glass transition temperature of the bonding layer is greater than the glass transition of the damping layer, and the difference between the glass transition temperatures is related to the relative thicknesses of the damping layer and the bonding layer. The multilayer tape constructions may further comprise a carrier layer. Also provided are systems and methods using the disclosed multilayer tape constructions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.