Clamping device
US12071683B2 · kind B2 · utility
0Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Dec 16, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/5397
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure relates to a clamping device configured to clamp a substrate. The clamping device includes a clamping plate and a flattening mechanism. The flattening mechanism includes at least one adjusting member configured to operably act on the clamping plate to apply a force to the clamping plate to flatten the clamping plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.