Plating system and method of plating wafer
US12071701B2 · kind B2 · utility
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20Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 24, 2023 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Apr 24, 2043 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating system is provided. The plating system includes an electroplating chamber defining a plating region within which a wafer is plated. The electroplating chamber includes an inlet configured to introduce plating solution into the plating region of the electroplating chamber. The electroplating chamber includes an outlet configured to remove the plating solution from the plating region of the electroplating chamber. The plating system includes a barrier configured to inhibit removal of the plating solution from the plating region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.