Phased array LiDAR transmitting chip of multi-layer materials, manufacturing method thereof, and LiDAR device
US12072445B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Apr 23, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12166
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A phased array LiDAR transmitting chip of multi-layer materials includes: a first material structure layer and an SOI silicon waveguide structure layer, a rear end of the first material structure layer and a front end of the SOI silicon waveguide structure layer form a coupling connection structure. The first material structure layer includes an input coupler and a beam splitter. The input coupler is optically connected to the beam splitter. The beam splitter is optically connected to the SOI silicon waveguide structure layer through the coupling connection structure. The input coupler couples input light to the chip. The beam splitter split a light wave coupled to the chip. The coupling connection structure couples each split light wave to a silicon waveguide in the SOI silicon waveguide structure layer. A non-linear refractive index of a first material in the first material structure layer is lower than that of a silicon material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.