Power over cable via stub effect mitigation method and system for camera interface of high speed printed circuit board for autonomous vehicles
US12072747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2022 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Mar 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09627
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a printed circuit board (PCB) includes a substrate, one or more signal layers including a first signal layer, a first segment of a transmission line disposed at the first signal layer electrically coupling a first location to a second location, and a first signal via disposed at the second location. The PCB circuit includes a second segment of the transmission line disposed at the first signal layer electrically coupling a third location to a fourth location and a second signal via disposed at the third location. The PCB includes a power-over-cable circuit disposed on a first surface of the substrate and electrically coupled to the first and second signal via, where the first and second segments carry a signal of an image sensor and the first segment carries power from the power-over-cable circuit to the image sensor, where the image sensor is used for an autonomous vehicle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.