Wafer processing apparatus and wafer processing method
US12074054B2 · kind B2 · utility
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1References
8Claims
0Family size
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Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Jun 7, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/11
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.