Device packages with uniform components and methods of forming the same
US12074149B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Feb 5, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Oct 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device package includes a first and a second input lead and a plurality of uniform transistor-based components, the plurality of uniform transistor-based components comprising a first subset of the uniform transistor-based components coupled to the first input lead and a second subset of the uniform transistor-based components coupled to the second input lead. The first subset and the second subset are arranged in an asymmetric configuration with respect to one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.