Semiconductor device structure with magnetic element
US12074193B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2023 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Mar 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/05
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.