Circuit board assembly
US12074295B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2021 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Nov 15, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly includes a wiring board, a coin-type secondary cell that is a lithium secondary cell electrically connected to the wiring board by reflow soldering, and a wireless communication device electrically connected to the wiring board. The coin-type secondary cell includes a positive electrode including a sintered body, a negative electrode including a sintered body, an electrolyte layer provided between the positive electrode and the negative electrode, and a cell case having an enclosed space in which the positive electrode, the negative electrode, and the electrolyte layer are housed. When C is given as the capacity of the positive electrode and A is given as the capacity of the negative electrode, 1.03<C/A<1.60 is satisfied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.