Power conversion device
US12074532B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 2020 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Jan 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/209
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A technology that prevents an encapsulation member encapsulating a semiconductor element from leaking between a resin-made casing and a heat dissipator is provided. A power conversion device includes a heat dissipator that includes a mount surface on which semiconductor elements are mounted, a resin-made casing that includes an intimate-contact surface that intimately contacts the mount surface, and which contains therein the semiconductor elements, and an encapsulation member that encapsulates the semiconductor elements within the casing. A first surrounding portion that surrounds the semiconductor elements is provided on the mount surface of the heat dissipator. A second surrounding portion that surrounds the semiconductor elements is provided on the intimate-contact surface of the casing. The first surrounding portion and the second surrounding portion are fitted with each other in the concavo-convex shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.