Secured housing for electronic device and method for encasing an electronic device
US12074626B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 25, 2020 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Jun 13, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/1633
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The housing provides layers of rigid material, a cut resistant layer, such as a cut resistant fabric layer, and cushioning around the components of a mobile electronic device, such as a tablet. The electronic device is at least partially encased within the housing providing a cut resistant layer within a rigid layer. The housing may provide two layers of cut resistant fabric, an outer layer impregnated with the rigid layer and an inner layer that maintains the properties of the cut resistant fabric. Cushioning located internally of the rigid layer and the cut resistant layers at least partially surround the components of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.