Metal ceramic substrate and method for manufacturing such metal ceramic substrate
US12075557B2 · kind B2 · utility
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24Claims
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Key dates
| Filing date | Oct 19, 2020 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Jun 23, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A carrier substrate (1) for electrical components, in particular metal-ceramic substrate (1) for electrical components, comprising
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.