Patent · US Active

Electronic device housing, electronic device, and compound body

US12075583B2 · kind B2 · utility

0Cited by

0References

15Claims

0Family size

Assignee

BYD Company Limited · CN

Inventors

Lan MA · Lake Forest Park, US
Haiyan Jin · Lo Wu, CN
Ling Pan · Mianyang, CN
Na Yu · San Jose, US
Liang Chen · Tangxia, CN

Key dates

Filing date	May 16, 2019
Grant date	Aug 27, 2024
Priority date	—
Expiry date	Jan 2, 2041

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/406
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.