Heat transfer interfaces for circuit card assembly (CCA) modules
US12075587B2 · kind B2 · utility
0Cited by
14References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2022 |
| Grant date | Aug 27, 2024 |
| Priority date | — |
| Expiry date | Oct 3, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20545
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic module assembly includes a circuit card assembly (CCA) including heat generating electronic components. A connector is electrically connected to the heat generating electronic components. The connector is positioned at a connection end of the CCA. A heatsink is mounted to the CCA and is connected in thermal communication with the electronic components. A wedge feature is defined along a lateral edge of the heatsink relative to the connector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.