Profiling device, profiling method, bonding system, bonding method, and display device
US12076891B2 · kind B2 · utility
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Key dates
| Filing date | Feb 28, 2022 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Aug 3, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3475
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A profiling device, a profiling method, a bonding system, a bonding method, and a display device are provided. The profiling device includes a profiling jig. The profiling jig includes an attaching surface. The attaching surface is switchable between a planar state and a profiling state, and the attaching surface is a planar surface in the case that the attaching surface is in the planar state, and the attaching surface is a profiling surface in the case that the attaching surface is in the profiling state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.