Thermal debinding techniques for additive manufacturing and related systems and methods
US12077660B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Nov 13, 2020 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Jun 18, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Techniques for debinding additively fabricated parts are described that do not require solvent debinding or catalytic debinding, and that may be performed using only thermal debinding in a furnace. As a result, in at least some cases debinding and sintering may take place sequentially within a single furnace. In some embodiments, the techniques may utilize particular materials as binders that allow for a thermal debinding process that does not negatively affect the parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.