Techniques for reducing an eddy current in a ground plane of a coreless sensor
US12078662B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2022 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Nov 30, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A current sensor system includes a current sensor integrated circuit (IC) and a printed circuit board (PCB) having a ground plane with a feature configured to reduce an eddy current. The current sensor IC includes a lead frame comprising a die attach pad and at least one lead, a semiconductor die having a first surface attached to the die attach pad and a second, opposing surface, at least one magnetic field sensing element supported by the semiconductor die and configured to sense a current in a proximate primary conductor, and a non-conductive mold material enclosing the semiconductor die and a portion of the at least one lead. The PCB ground plane feature can take various forms such as a hole of a dimension larger than the current sensor IC, elongated cuts, or x-shaped cuts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.