Optical phased array structure and fabrication techniques
US12078911B2 · kind B2 · utility
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Key dates
| Filing date | Oct 5, 2020 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Jun 7, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2202/105
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods of manufacturing and operating a monolithically integrated optical phase array (OPA) chip device, and the device itself. A three-dimensional (3-D) integrated optical phase array (OPA) chip device. A system of complementary metal-oxide-semiconductor (CMOS) electronics integrated with a three-dimensional integrated optical array chip device. A method of three-dimension photonic integration to improve optical power in optical phase arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.