Photosensitive resin composition, pattern forming method, cured film, laminate, and device
US12078929B2 · kind B2 · utility
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23Claims
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Key dates
| Filing date | Jun 2, 2021 |
| Grant date | Sep 3, 2024 |
| Priority date | — |
| Expiry date | Dec 4, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
There are provided a photosensitive resin composition containing at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, a compound having a sulfurous ester structure, and a photoradical polymerization initiator, and satisfies at least one of the following conditions 1, . . . , or 3; a pattern forming method using a photosensitive film formed from the photosensitive resin composition; a cured film formed from the photosensitive resin composition; a laminate including the cured film; and a device having the cured film or the laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.